SK Hynix to spend 19 trillion won in new chip packaging fab
SK Hynix announced a 19 trillion won investment to build a new advanced packaging fab (P&T7) in Cheongju, dedicated to HBM production for AI chips, with completion slated for late 2027. This is a preemptive move to address surging HBM demand, which is expected to grow 33% annually until 2030, and will complement the nearby M15X DRAM fab. Bearish: This significant capacity expansion for a supply-constrained component (HBM) aims to alleviate shortages, potentially easing future price pressures as new supply comes online from 2027 onward.
- Related manufacturers
- SK Hynix
- Impact score
- 60 / 100, medium impact