NuAxi半导体贸易情报
CGD新增两款GaN封装提升散热
发生了什么
Fabless firm CGD announced two new package variants for its ICeGaN family, offering enhanced thermal performance and simplified inspection. These DFN-style packages are designed to be rugged and reliable. 关注：新产品发布，短期供需影响有限。
影响与信号
低影响影响力评分：10/100
受影响器件与厂商
GaN power ICs
Cambridge GaN Devices Ltd
product_launchgallium_nitride
来源与时间
来源：Semiconductor Today · 2024/6/4 · 查看原始来源
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