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Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demos record low insertion loss at frequencies up to 325GHz
What happened
Imec demonstrated its 300mm RF silicon interposer platform achieving a record-low insertion loss of 0.73dB/mm at frequencies up to 325GHz at ECTC 2025. This R&D milestone aims to enable more compact and scalable next-generation RF and mixed-signal systems through heterogeneous integration. Neutral: This is a long-term technology development with no immediate impact on component supply, pricing, or trading decisions.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
RF Silicon InterposerRF Chiplet
imec
rd-milestoneheterogeneous-integration
Source and time
Source: Semiconductor Today · 5/28/2025 · View original source
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