TDK and Microchip Technology partner to enable sensor networks for robotics

What happened

TDK Corporation (TSE:6762) and Microchip Technology Inc. (NASDAQ: MCHP) are demonstrating a distributed sensor-node platform for next-generation robotic systems at electronica in Munich this week (TDK booth B5.520). The platform combines sensing technology from InvenSense, a TDK group company, with Microchip's dsPIC33A Digital Signal Controller (DSC) and LAN8651/LAN8679 based 10BASE-T1S single-pair Ethernet connectivity for real-time intelligence and edge AI processing for robotics applications. The demonstration board combines a Microchip dsPIC33A DSC, LAN8651/LAN8679 10BASE-T1S connectivity, a TDK InvenSense ICM-42688-P 6-axis inertial measurement unit (IMU), and a MikroE expansion connector for compatible additional TDK sensors. The dsPIC33A DSC can process and fuse the InvenSense IMU data locally before transmitting relevant information over the 10BASE-T1S network, reducing latency, network traffic, and the computational workload of the robot's central controller. The source states that today's humanoid robots may incorporate 100 or more sensors, and the platform is designed to help robotics developers integrate a greater number of intelligent sensor nodes while simplifying cabling and communications. Massimo Mascotto, director of product marketing for InvenSense, said the partnership with Microchip aims to solve the real customer need of easily integrating a multitude of sensors with dedicated, distributed processing capabilities for fast local intelligence. The Microchip dsPIC33A DSC combines a 200 MHz 32-bit core, DSP acceleration, and a double-precision floating-point unit with high-speed ADCs and high-resolution PWM capabilities. Additional TDK sensing solutions for smart perception in robotics, including TMR and Hall sensors for ultra-precise angle detection, MEMS microphones for acoustic activity detection, temperature sensors for environmental monitoring, pressure sensors for tactile sensing, and 9-axis IMU+TMR sensing for exact location and orientation detection, will be demonstrated at electronica, Munich, November 10-13.

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Source: EE Journal · 11/11/2026 · View original source