NuAxiSemiconductor trade intelligence
SynPower and AblePrint to co-develop equipment to curb substrate warpage
What happened
SynPower has signed a strategic cooperation agreement with AblePrint Technology (APT) to jointly develop substrate equipment with warpage suppression annealing system (WSAS) functions. The companies said the agreement deepens their collaboration in semiconductor advanced packaging and high-end Ajinomoto Build-up Film (ABF) products. The agreement has been signed, and the joint development of the equipment is a cooperative plan under it.
Impact and signal
Medium impactImpact score: 45/100
Affected components and suppliers
substrate equipment with warpage suppression annealing system (WSAS) functionsAjinomoto Build-up Film (ABF) products
SynPowerAblePrint Technology (APT)
strategic cooperation agreementadvanced packagingABFwarpage suppression annealing systemsubstrate equipment
Source and time
Source: DigiTimes Asia · 11/10/2026 · View original source
Open the NuAxi live feed →
Real-time pricing, supply signals and AI analysis for semiconductor traders