[News] Samsung 2nm Taylor Fab 2 Reportedly Fully Booked Before 2030 Output, Led by AMD HBM Base Die Orders

What happened

Samsung Electronics' second plant in Taylor, Texas (Taylor Fab 2), which reportedly plans to adopt a 2nm process to produce HBM base dies, has reportedly secured orders covering its entire planned production capacity ahead of 2030 output, with AMD accounting for the majority; sources indicate the facility's capacity could be stretched even by AMD's orders alone, per Maeil Business Newspaper citing industry sources. The 2nm or more advanced base dies would serve next-generation HBM demand, while its mass-produced HBM4 and sampled HBM4E use 4nm base dies. The facility will span 2.7 million square feet (approximately 250,000 square meters), about 1.5 times the size of Taylor Fab 1; preparatory work including site preparation and ground leveling is already underway, full-scale construction is scheduled to begin in early November 2026, equipment installation is expected to start in February 2029, and mass production is planned for 2030. Once production begins, Samsung plans to combine Taylor Fab 2 base dies with DRAM produced in South Korea to supply completed HBM products. In a separate report, industry observers see Broadcom as another potential customer for HBM base dies from Taylor Fab 2; per ChosunBiz, Samsung could also manufacture 2nm AI chips for a U.S. cloud customer through Taiwan-based ASIC design firm Faraday, although manufacturing orders remain unconfirmed. According to Reuters, Samsung said its third-quarter foundry revenue benefited from HBM logic die sales and advanced 2nm orders from hyperscalers and other AI customers, although the business remains loss-making. Uncertainty remains: NVIDIA has reportedly asked all three major memory manufacturers, including Samsung, to outsource NVHBM base die production to TSMC, and wider NVHBM adoption could limit Samsung Foundry's opportunities for additional base die orders if NVIDIA continues to favor TSMC.

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Source and time

Source: TrendForce · 11/3/2026 · View original source