CoAsia Semi Begins Shipments of Chips Made on Samsung’s 4nm Process

What happened

CoAsia Semi announced on Nov. 2 that it has begun mass-production shipments of semiconductor device wafers manufactured using Samsung Electronics' 4nm foundry process. Mass-production shipments of the device wafers began in mid-October. The devices fabricated on the wafers are network switch chips designed for high-speed data transmission and processing in high-performance computing (HPC) environments; each chip measures more than 800 square millimeters, the largest die CoAsia Semi has handled in any of its projects, and larger chip sizes make yield management more difficult. Supplies will be delivered in stages through 2029 in line with the customer's production schedule, with revenue recognized accordingly, and the total contract value is $175 million. CoAsia Semi said it secured the 4nm wafer production capacity needed for mass production in advance amid intensifying competition for manufacturing capacity, and is continuing to collaborate with the customer on a follow-up project. The company has previously signed mass-production supply agreements for AI chiplets with Rebellions and Tenstorrent; in August 2026, per the article, it became the first South Korean design house to begin mass production of an 8nm system-on-chip (SoC) using 3D IC packaging.

Impact and signal

Affected components and suppliers

Source and time

Source: The Elec · 11/2/2026 · View original source