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Intel's Lip-Bu Tan Discusses Possible AMD Cooperation, Lays Out CPU and Foundry Plans

What happened

Intel CEO Lip-Bu Tan, speaking during an October 24 fireside chat with Jimmy Cheng, president of the Chinese American Semiconductor Professional Association (CASPA), said he has spoken with AMD CEO Lisa Su about exploring potential areas of cooperation; he did not say what those areas are, and neither company has announced anything. AMD was earlier reported to be evaluating Intel's 14A node, but it could just as well be packaging, software, or something else. Tan said Intel has to 'reclaim the leadership in CPU' and will now tailor chips like Xeon to customer needs; he named ASICs, co-packaged optics, physical AI and advanced packaging as possible growth areas and wants two or three of them to eventually bring in around 10% of Intel's revenue each. On the foundry side, 18A is in volume production, while 14A has its 0.5 PDK out, with 0.9 next and 1.0 for volume production early next year; Intel had targeted October for handing the 0.9 PDK to outside customers, and Tan's 'stay tuned' suggests it hasn't happened just yet. The source does not state the cause.

Impact and signal

Medium impactImpact score: 45/100

Affected components and suppliers

CPU
AMDfoundry18A14APDKadvanced packaging

Source and time

Source: TechPowerUp · 10/28/2026 · View original source

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