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Intel's Lip-Bu Tan has spoken with Lisa Su about potential collaboration with AMD

What happened

Intel CEO Lip-Bu Tan has reportedly discussed potential areas of cooperation with AMD CEO Lisa Su, but Tan did not publicly detail the reported areas of potential cooperation during his October 24 fireside chat with Chinese American Semiconductor Professional Association (CASPA) President Jimmy Cheng, and neither company has announced a new agreement arising from the discussions. In the chat, Tan outlined plans to rebuild Intel's CPU business, develop chips tailored to specific customer workloads, and grow ASICs, co-packaged optics (CPO), physical AI and advanced packaging as potential growth businesses, with two or three of these areas eventually contributing around 10% of Intel's revenue each. He said the 18A process had reached volume production, 14A development was progressing strongly, PDK version 0.5 was released, version 0.9 was coming next, followed by version 1.0 for volume production in early 2027. In January, two prospective customers were evaluating 14A test chips, with firm supplier decisions expected during the second half of 2026 and the first half of 2027, though Intel did not identify those customers or disclose order sizes. The companies already cooperate: in October 2024 Intel and AMD established the x86 Ecosystem Advisory Group, and last week it emerged that AMD was integrating its ZenDNN optimizations into Intel's open-source oneDNN library.

Impact and signal

Medium impactImpact score: 45/100

Affected components and suppliers

custom chipsASICsadvanced packagingfoundry services
IntelAMDpotential collaborationfoundry18A14A

Source and time

Source: Tom's Hardware · 10/26/2026 · View original source

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