NuAxiSemiconductor trade intelligence
RT NEWS: Another price hike in the works? #TSMC is reportedly eyeing a 20% jump in #CoWoS prices, on top of planned foundry price increases, as AI GPU...
What happened
According to TrendForce, TSMC is reportedly eyeing a 20% jump in CoWoS (advanced packaging) prices, on top of planned foundry price increases. The source states the cause is a fresh surge in advanced packaging demand fueled by AI GPUs, server CPUs, and custom ASICs. The report also mentions TSMC skipping equipment price renegotiations (per the report title). Note: this is a 'reportedly' claim — a plan/intent, not a confirmed or effective price increase.
Impact and signal
High impactImpact score: 95/100
Affected components and suppliers
CoWoSAI GPUserver CPUcustom ASIC
TSMCCoWoSadvanced_packagingprice_hikefoundry_price_increaseTrendForce
Source and time
Source: TrendForce Official (Market Data) · 10/26/2026 · View original source
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