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CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026

What happened

Chinese DRAM maker CXMT's next DRAM milestone is a plan to achieve 4F² server memory using hybrid bonding by end-2026. At a recent shareholder meeting, management pledged to enter what it called the 'uncharted territory' of extreme memory scaling, and stated it would use process innovation to overcome technical barriers. The milestone remains a stated plan; the source does not state any progress beyond the roadmap, the cause, or market impact.

Impact and signal

Medium impactImpact score: 58/100

Affected components and suppliers

DRAM4F² server memory

CXMT

CXMTDRAM4F²hybrid bondingserver memoryroadmap

Source and time

Source: DigiTimes Asia · 10/20/2026 · View original source

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CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026

What happened

Impact and signal

Affected components and suppliers

Source and time

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