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RT NEWS: The advanced packaging race is heating up, but #TSMC isn’t fazed by the growing buzz around #Intel’s EMIB. CEO C.C. Wei says TSMC alone can...
What happened
According to a repost from TrendForce, TSMC CEO C.C. Wei said that despite the growing buzz around Intel's EMIB advanced packaging technology, TSMC is not fazed, and stated that TSMC alone can mass-produce 5x reticle-size packaging at high yields—and it is already pushing toward 9x. This is a statement by TSMC about its own packaging capability and technology position; the source does not state the cause beyond the reported remarks, and no specific price or volume changes are given.
Impact and signal
Low impactImpact score: 0/100
Affected components and suppliers
5x reticle-size advanced packaging9x reticle-size advanced packagingIntel EMIB
advanced packagingreticle-sizeTSMCIntel EMIBC.C. WeiTrendForce
Source and time
Source: TrendForce Official (Market Data) · 10/15/2026 · View original source
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