NuAxiSemiconductor trade intelligence
IBM and Siemens team up to advance 3D nanostack chip technology
What happened
IBM and Siemens have announced a research collaboration to advance IBM's 3D nanostack transistor architecture, targeting the design and manufacturing challenges of future angstrom-scale semiconductors. The partnership will combine IBM's semiconductor research with Siemens' electronic design automation (EDA), simulation and lithography expertise to help move the technology closer to commercial production. This is a research collaboration, with commercial production a goal rather than an achieved result; the source does not state the cause or a specific timeline.
Impact and signal
Medium impactImpact score: 45/100
Affected components and suppliers
3D nanostack transistor architecture
IBMSiemens
research_collaborationEDAlithographyangstrom-scale3D_nanostack
Source and time
Source: eeNews Europe · 10/14/2026 · View original source
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