(PR) IBM and Siemens Collaborate on Research to Advance Nanostack Architecture

What happened

IBM (NYSE: IBM), in collaboration with Siemens, today announced new research aimed at advancing IBM's nanostack architecture, a new transistor architecture IBM unveiled earlier this year. The collaboration will combine IBM's leadership in semiconductor device innovation with Siemens' expertise in electronic design automation (EDA), process simulation, lithography optimization, and advanced manufacturing software to accelerate the development of nanostack. According to the source, nanostack is the industry's first known three-dimensional, nanosheet-based design, vertically stacking and staggering transistors to pack more transistors onto a chip, with nearly 100 billion transistors in a space the size of a fingernail at its current 7 angstrom node. The design also unlocks the use of different material combinations within each stacked layer to optimize each transistor's performance and power efficiency independently, powering leaps in energy efficiency, performance, and SRAM scaling. This is an announced research collaboration, in the planning stage; the source does not state the cause.

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Source: TechPowerUp · 10/14/2026 · View original source