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OIPT launches alternative to CMP for epi-prep of silicon carbide substrates
What happened
Oxford Instruments Plasma Technology (OIPT) has launched a plasma polishing method as an alternative to CMP for preparing silicon carbide substrates for epitaxy. The technology claims to alleviate technical, environmental, and supply chain issues associated with traditional CMP. Neutral: This is a long-term process improvement with no immediate impact on SiC wafer supply, pricing, or trader inventory decisions.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Silicon Carbide Substrates
Oxford Instruments Plasma Technology
manufacturing-processsupply-chain-optimizationepitaxy
Source and time
Source: Semiconductor Today · 8/29/2022 · View original source
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