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Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
What happened
DIGITIMES analyst Luke Lin predicts hybrid bonding will drive advanced packaging capacity expansion in 2027-2028, drawing attention at SEMICON Taiwan 2026. This signals a shift in packaging technology trends. Traders should watch for supply chain adjustments in advanced packaging capacity.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
HBM5SoICCoWoSEMIB-T
advanced-packagingcapacity-expansionforecasthybrid-bonding
Source and time
Source: DigiTimes Asia · 9/5/2026 · View original source
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