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👀 #MediaTek confirms its AI ASIC collaboration with #Intel’s EMIB-T advanced packaging. The chipmaker is now pushing 400G SerDes IP to target next...

What happened

MediaTek confirms AI ASIC collaboration with Intel using EMIB-T advanced packaging, advancing 400G SerDes IP. Targeting next-gen opportunities including Google TPU v10 and Meta custom chips. 关注 - 暗示高端AI芯片封装与高速接口需求增长。

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

400G SerDes IPEMIB-T (Advanced Packaging)
AISerDesAdvanced PackagingPartnership

Source and time

Source: TrendForce Official (Market Data) · 8/3/2026 · View original source

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