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Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO

What happened

Merck Electronics CEO Benjamin Hein stated that advanced packaging materials are poised to outgrow front-end process materials and the broader materials market. Driven by generative AI demand for computing power and bandwidth, the industry is shifting innovation toward advanced packaging, silicon photonics, and CPO. Watch.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

Advanced Packaging MaterialsNPOCPOFront-end process materials
Merck
advanced-packagingnpocpodemand-growth

Source and time

Source: DigiTimes Asia · 7/15/2026 · View original source

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