NuAxiSemiconductor trade intelligence
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
What happened
Merck Electronics CEO Benjamin Hein stated that advanced packaging materials are poised to outgrow front-end process materials and the broader materials market. Driven by generative AI demand for computing power and bandwidth, the industry is shifting innovation toward advanced packaging, silicon photonics, and CPO. Watch.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Merck
Source and time
Source: DigiTimes Asia · 7/15/2026 · View original source
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