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The Packaging PDK Is the Missing Layer for Co-Packaged Optics
What happened
CPO technology requires shifting from device design to full electro-optical path realization, with packaging PDKs becoming a critical missing link. As AI infrastructure demands higher bandwidth and power efficiency, the industry must address the interfaces between PICs, ASICs, and packaging layers. Neutral impact on immediate trading decisions.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Source and time
Source: SemiWiki · 7/7/2026 · View original source
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