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NXP launches top-side-cooled RF amplifier modules

What happened

NXP Semiconductors launched a family of top-side-cooled RF amplifier modules based on GaN technology. The packaging innovation aims to enable thinner, lighter, and more efficient 5G infrastructure radios. Neutral: This is a product announcement with no immediate impact on supply, demand, or pricing of existing electronic components.

Impact and signal

Low impactImpact score: 15/100

Affected components and suppliers

RF Amplifier ModulesGaN Power Devices

NXP Semiconductors N.V.

5Gpackaginginnovation

Source and time

Source: Semiconductor Today · 6/6/2023 · View original source

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NXP launches top-side-cooled RF amplifier modules

What happened

Impact and signal

Affected components and suppliers

Source and time

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