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SiC-Based 500 kW/l Inverter Built on AMB Chip Embedding

What happened

Fraunhofer IZM demonstrated a 500 kW/l inverter module utilizing SiC MOSFETs and AMB chip embedding technology. This design optimizes power density and thermal performance through PCB embedding. The impact on current market prices is neutral as this is a research project.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

SiC MOSFETsPower Modules

Fraunhofer IZMMitsubishi ElectricAT&SInfineon Technologies

technicalpackagingSiCR&D

Source and time

Source: Power Electronics News · 6/23/2026 · View original source

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SiC-Based 500 kW/l Inverter Built on AMB Chip Embedding

What happened

Impact and signal

Affected components and suppliers

Source and time

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