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[News] New Thermal Management Breakthrough: GaN-on-Sapphire Substrate Thinned to 50μm
What happened
Ziener Tech has successfully thinned 8-inch GaN-on-sapphire wafers to 50μm, significantly reducing thermal resistance to 0.8°C/W. This technical breakthrough addresses the heat dissipation bottleneck in GaN devices, offering performance superior to silicon-based solutions. 利多: The improved thermal management capability enhances the competitiveness of GaN-on-sapphire in high-power applications.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
GaN-on-Sapphire substrate
Ziener Tech
thermal_managementGaNsubstrate
Source and time
Source: TrendForce · 4/26/2026 · View original source
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