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[News] SK hynix Breaks Ground on P&T7 Advanced Packaging Fab in Cheongju, Wafer-level Packaging Set for 2028 Ramp

What happened

SK hynix broke ground on a KRW 19 trillion advanced packaging fab (P&T7) in Cheongju, targeting wafer-level packaging production in 2028. This investment is part of a broader push to expand HBM and AI memory packaging capacity, including a new U.S. facility. Neutral: Long-term capacity addition addresses future demand but has no immediate impact on current supply or prices.

Impact and signal

Medium impactImpact score: 58/100

Affected components and suppliers

HBMAI Memory

SK hynix

capacity-expansionadvanced-packagingfab-construction

Source and time

Source: TrendForce · 4/21/2026 · View original source

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[News] SK hynix Breaks Ground on P&T7 Advanced Packaging Fab in Cheongju, Wafer-level Packaging Set for 2028 Ramp

What happened

Impact and signal

Affected components and suppliers

Source and time

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