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[News] Intel Launched World’s First Thinnest GaN Chiplet

What happened

Intel Foundry Services announced a technological milestone with a 19-micrometer-thick GaN chiplet integrating power transistors and digital logic on 300mm silicon wafers, achieving 78V withstand voltage and >300 GHz RF cutoff. This R&D advance leverages existing fab infrastructure for potential cost reduction in high-power/high-frequency applications. Impact: NEUTRAL - This is a long-term R&D development with no immediate impact on component supply, pricing, or trading decisions.

Impact and signal

Low impactImpact score: 15/100

Affected components and suppliers

GaN Power Transistors
Intel Foundry Services
technology-milestoneR&D

Source and time

Source: TrendForce · 4/13/2026 · View original source

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