China OSATs step up investment drive as AI demand lifts advanced packaging race

What happened

Leading Chinese OSATs, including JCET and Tongfu Microelectronics, are accelerating capacity expansion and technology upgrades to capture rising demand from AI and HPC applications. This investment drive is a response to the global race in advanced packaging, a critical bottleneck for AI chip production. 利多: Potential long-term easing of advanced packaging supply constraints, but near-term impact on spot prices is uncertain as new capacity ramps.

Impact and signal

Affected components and suppliers

Source and time

Source: DigiTimes Asia · 4/9/2026 · View original source