NuAxiSemiconductor trade intelligence
RT NEWS: 🤔 JEDEC is reportedly eyeing looser #HBM height specs (~900µm), potentially easing stacking complexity— but if TC bonding remains viable...
What happened
JEDEC is reportedly considering loosening HBM package height specifications to approximately 900µm, which could reduce stacking complexity. This potential change, if TC bonding remains viable for higher stacks, may slow the adoption of hybrid bonding technology. Neutral: This is a long-term technical roadmap discussion with no immediate impact on supply, demand, or pricing.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
specificationhybrid-bonding
Source and time
Source: TrendForce Official (Market Data) · 4/1/2026 · View original source
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