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Why Co-Packaged Optics Should be Viewed as an Architectural Commitment (UW-Madison, MIT et al.)
What happened
A new paper from UW-Madison, MIT, and Invictus Innovation EV Technology highlights that AI-driven workloads are forcing a rethink of optical interconnect architectures in datacenters, promoting the adoption of Co-Packaged Optics (CPO) and 3D photonic integration.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Co-Packaged Optics3D Photonic Integration
University of Wisconsin-MadisonMITInvictus Innovation EV Technology
Source and time
Source: Semiconductor Engineering · 3/31/2026 · View original source
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