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SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die

What happened

SK Hynix is evaluating TSMC's 3nm process for the logic die of its upcoming HBM4E product. This is a strategic move aimed at closing a potential performance gap with competitor Samsung Electronics. Neutral: This is a long-term R&D evaluation with no immediate impact on supply, demand, or pricing for existing HBM products.

Impact and signal

Low impactImpact score: 12/100

Affected components and suppliers

HBM4E

SK Hynix TSMC

technology_trendhbmfoundry

Source and time

Source: DigiTimes Asia · 3/25/2026 · View original source

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SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die

What happened

Impact and signal

Affected components and suppliers

Source and time

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