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SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung

What happened

SK Hynix is evaluating TSMC's 3nm process for the logic die in its upcoming HBM4E product. This is a long-term R&D decision aimed at gaining a performance edge over competitors like Samsung. Neutral: This is a future technology roadmap item with no immediate impact on current HBM supply, pricing, or trader decisions.

Impact and signal

Low impactImpact score: 15/100

Affected components and suppliers

HBM4E
hbmprocess-noderd-milestone

Source and time

Source: DigiTimes Asia · 3/22/2026 · View original source

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