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Telink TL322X+ML3228A Launched at Embedded World 2026

What happened

Telink unveiled the TL322X SoC and ML3228A module at Embedded World 2026, featuring dual-core RISC-V architecture and multi-protocol support including Bluetooth, Zigbee, and Thread. The launch targets automotive-grade IoT applications with AEC-Q100 certification.

Impact and signal

Low impactImpact score: 25/100

Affected components and suppliers

TL322XML3228A

Telink Semiconductor

TL322X ML3228A

RISC-VIoTBluetoothZigbeeThreadMatter

Source and time

Source: EE Times · 3/20/2026 · View original source

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Telink TL322X+ML3228A Launched at Embedded World 2026

What happened

Impact and signal

Affected components and suppliers

Source and time

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