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[News] SK hynix Reportedly Weighs TSMC 3nm for HBM4E Logic Dies to Gain Edge over Samsung

What happened

SK hynix is reportedly considering TSMC's 3nm process for its HBM4E logic dies, aiming for a performance edge over Samsung's in-house 4nm. This reflects the intensifying competition in advanced HBM, where custom logic dies tailored to client specs are becoming a key battleground. 利多: No immediate supply or price impact; this is a long-term technology roadmap decision for 2026+ products.

Impact and signal

Low impactImpact score: 15/100

Affected components and suppliers

HBM4EHBM5
technology-trendfoundryhbm

Source and time

Source: TrendForce · 3/19/2026 · View original source

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