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[News] SK hynix Reportedly Weighs TSMC 3nm for HBM4E Logic Dies to Gain Edge over Samsung
What happened
SK hynix is reportedly considering TSMC's 3nm process for its HBM4E logic dies, aiming for a performance edge over Samsung's in-house 4nm. This reflects the intensifying competition in advanced HBM, where custom logic dies tailored to client specs are becoming a key battleground. 利多: No immediate supply or price impact; this is a long-term technology roadmap decision for 2026+ products.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
HBM4EHBM5
Source and time
Source: TrendForce · 3/19/2026 · View original source
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