NuAxiSemiconductor trade intelligence
RT NEWS: 🚀 #China’s Nixi Semiconductor says it has built the world’s first 35-μm ultra-thin wafer process and packaging line for power chips, re...
What happened
China's Nixi Semiconductor claims to have developed the world's first 35-μm ultra-thin wafer process and packaging line for power chips, reportedly reducing resistance and cutting carrier transit time by 40%. This is a manufacturing technology milestone specific to power semiconductor production. Neutral: This R&D announcement has no immediate, quantifiable impact on trading dynamics for power chip supply, demand, or pricing.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
Power Semiconductors
Nixi Semiconductor
packagingrd-milestonepower-chips
Source and time
Source: TrendForce Official (Market Data) · 3/16/2026 · View original source
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