Fujitsu Showcases "MONAKA" CPU Sample with 3.5D XDSiP Packaging

What happened

Fujitsu unveiled an engineering sample of its 'MONAKA' CPU, a 144-core Armv9-A chiplet design manufactured on TSMC 2nm and packaged using Broadcom's 3.5D XDSiP technology, targeting AI/HPC workloads for 2027 release. This is a long-term R&D milestone for Fujitsu's high-performance computing roadmap, following its Fugaku supercomputer success. Neutral: No immediate supply, demand, or price impact on existing components; this is a future product announcement.

Impact and signal

Affected components and suppliers

Source and time

Source: TechPowerUp · 3/9/2026 · View original source