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Infineon launches CoolGaN G3 Transistor in new silicon-footprint packages

What happened

Infineon has launched its CoolGaN G3 Transistor in two new silicon-footprint packages (100V in RQFN 5x6 and 80V in RQFN 3.3x3.3) to address the market fragmentation in GaN packaging. This move aims to provide customers with multiple footprint-compatible sources, potentially easing design-in and procurement. Neutral: This is a product introduction aimed at improving market standardization, with no immediate, direct impact on supply, demand, or pricing of existing components.

Impact and signal

Low impactImpact score: 25/100

Affected components and suppliers

GaN Transistor

Infineon Technologies AG

IGD015S10S1 IGE033S08S1

packagingstandardizationproduct-launch

Source and time

Source: Semiconductor Today · 2/18/2025 · View original source

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Infineon launches CoolGaN G3 Transistor in new silicon-footprint packages

What happened

Impact and signal

Affected components and suppliers

Source and time

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