NuAxiSemiconductor trade intelligence

Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt

What happened

Equipment makers Hanwha Semitech and Semes are accelerating development of hybrid bonding tools to challenge Hanmi Semiconductor's dominance in thermal compression bonding for HBM production. Significant technical and cost barriers remain before hybrid bonding sees widespread adoption in HBM manufacturing. Neutral: This is a long-term R&D competition with no immediate impact on HBM supply, pricing, or procurement.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

HBM

Hanmi SemiconductorHanwha SemitechSemes

equipmenthybrid-bondingTCB

Source and time

Source: DigiTimes Asia · 3/4/2026 · View original source

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Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt

What happened

Impact and signal

Affected components and suppliers

Source and time

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