NuAxiSemiconductor trade intelligence
Imec PDKs for packaging sub-2nm chiplets
What happened
Imec released two early-access PDKs for sub-2nm chiplet packaging: a fine-pitch RDL PDK enabling 1.3-micron lines and a D2W hybrid bonding PDK. This is an R&D milestone from a research institute, providing design tools but not commercial production capacity. Neutral: No immediate impact on component supply, pricing, or trader inventory decisions.
Impact and signal
Low impactImpact score: 12/100
Affected components and suppliers
Advanced PackagingRDLHybrid Bonding
Imec
R&Dpackagingchiplets
Source and time
Source: Electronics Weekly · 3/2/2026 · View original source
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