NuAxiSemiconductor trade intelligence

NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs

What happened

NanoIC pilot line releases first-of-a-kind PDKs for fine-pitch RDL and D2W hybrid bonding, enabling 1.3-micron line widths and 20-micron pitches to support high-density chiplet integration.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

NanoICimec

R&DTechnologyPDKHybrid Bonding

Source and time

Source: EE Journal · 3/2/2026 · View original source

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NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs

What happened

Impact and signal

Affected components and suppliers

Source and time

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