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(PR) NanoIC Launches Advanced Interconnect PDKs for Chip-to-Chip Designs
What happened
NanoIC pilot line, coordinated by imec, released two early-access advanced interconnect PDKs for fine-pitch RDL and die-to-wafer hybrid bonding. This R&D milestone aims to enable high-density chiplet integration for future high-performance computing and AI accelerators. Neutral: No immediate impact on component supply, pricing, or production capacity.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Advanced PackagingChiplet Interconnect
imec
R&DPDKAdvanced Packaging
Source and time
Source: TechPowerUp · 3/2/2026 · View original source
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