SK hynix, Samsung, and Micron are collaborating with JEDEC to develop DDR6, targeting commercial shipments in 2028. The standard aims for up to 17,600 MT/s throughput and a new 4x24-bit sub-channel architecture. Server platforms will lead adoption, followed by high-end notebooks.
Navitas Semiconductor appointed semiconductor veteran Davin Lee to its board, serving on the Compensation Committee and the Governance and Sustainability Committee. This is a routine corporate governance update with no immediate impact on supply chain or pricing.
KYOCERA AVX launched new high-temperature Multilayer Varistors (MLVs) optimized for 48V automotive power supply systems. These devices offer enhanced protection and are qualified to VDA-320 standards. Neutral impact on market prices as this represents a new supply addition rather than a shortage.
Advantest joins Applied Materials' EPIC platform as the first ATE supplier, aiming to integrate front-end manufacturing with back-end testing. This partnership focuses on optimizing performance and efficiency for next-generation semiconductors. Traders should monitor this supply chain integration for potential efficiency gains.
Intel's EMIB packaging technology achieved a 90% yield milestone, securing adoption from Google for TPU v8e and Meta for in-house CPUs. This progress highlights Intel's competitive push against TSMC's constrained CoWoS capacity, though TSMC plans significant capacity expansion to maintain its lead.
Nvidia CEO Jensen Huang claims the company's AI accelerator market share in China has dropped to 0% due to US export restrictions. Bernstein previously estimated the share would fall from 66% to roughly 8%, driven by domestic vendors covering up to 80% of demand. This shift accelerates China's self-sufficiency drive, posing a long-term threat to US chip dominance in the region.
Lite-On Technology reported Q1 revenue of NT$43.4 billion, up 19% year-over-year, driven by surging demand for AI infrastructure and rapid growth in its cloud-related business.
Chinese memory makers including Shenzhen Longsys Electronics and Montage Technology reported strong first-quarter gains driven by a structural demand shift from AI and tightened supply, leading to price resets.
The EU-funded HiPower 5.0 project aims to develop GaN-based EV on-board chargers to overcome current efficiency and reliability limits. Existing OBC models are approaching their performance ceilings, prompting this targeted R&D initiative. Neutral. This is a technology trend with no immediate impact on supply chain pricing or availability.
IDTechEx forecasts SiC MOSFETs will become the majority technology in EV power electronics by 2036. This shift is driven by demand for higher efficiency and power density in EVs, data centers, and renewable energy. Bullish: Accelerated adoption of SiC and GaN is expected to drive long-term demand growth.
Murata starts mass production of MRMS166R and MRMS168R AMR sensors with ultra-low power consumption (20nA-80nA) for wearables and medical devices. This new product launch introduces a new component to the market, likely neutral for existing component pricing.
Cirrascale CEO David Driggers highlights that traditional data center planning fails for AI due to power and cooling constraints, specifically noting the shift to liquid cooling for racks exceeding 50kW.
Powell Electronics confirms in-stock availability of Winchester Micro-D SMT connectors for high-reliability applications. These rugged connectors feature high current ratings and are designed for defense and aerospace sectors. Neutral - Supply availability confirmed, no immediate price pressure.
Alpha and Omega Semiconductor launched its SmartClamp™ protected DrMOS family, targeting AI server and high-end GPU power delivery. The product offers integrated over-current protection to address inductor saturation risks in high-current environments. Neutral: This is a standard product launch with no immediate impact on supply, demand, or pricing of existing components.
ASML shipped 131 DUV tools in 2025, generating €32.7 billion in revenue. Chinese customers accounted for 70% of DUV sales in 2024 due to tightening Dutch export restrictions. Bullish for ASML and DUV equipment supply.
Larsen & Toubro (L&T) has launched a new industrial electronics manufacturing business, L&T Electronic Products & Systems (LTEPS), with two initial production lines in Coimbatore. The move aims to deepen L&T's technology portfolio and support India's self-reliance in electronics manufacturing. Neutral: This is a long-term capacity addition in a niche B2B segment with no immediate, direct impact on component pricing or supply.
QMatter raised $1.2M for its quantum compression platform, targeting life sciences R&D. This is a funding milestone for a quantum computing startup.
Rolls-Royce and Voltaria signed a 15-year EPC contract for a 43 MW/86 MWh battery energy storage system in Scotland, scheduled for 2027. This marks Rolls-Royce's first large-scale UK BESS project, utilizing CATL battery solutions and mtu EnergyPack technology. The deal signals confirmed future demand for energy storage components and long-term service contracts.
JEDEC published the JESD82-552 standard for DDR5 MDB and advanced the MRDIMM Gen 2 roadmap, targeting 12,800 MT/s and introducing the MRCD standard.
Bosch introduces third-generation SiC chips and provides samples to automakers, aiming to enhance EV efficiency and range. This technological advancement supports the growing demand for wide bandgap materials in electric vehicles and data centers. Bullish for SiC adoption.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |