Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year
Intel is reportedly in advanced talks with Google and Amazon to provide EMIB-T advanced packaging services for their custom AI processors, potentially generating billions in annual revenue for Intel Foundry. Intel's next-gen EMIB-T packaging, enabling larger and more complex chiplet assemblies, is set for production rollout this year.
Potential major new demand for Intel's packaging capacity, signaling a shift in the AI chip supply chain.
- Related manufacturers
- Intel Corporation, Google, Amazon
- Impact score
- 45 / 100, medium impact