SK hynix reported record Q2 revenue driven by AI memory demand, with server DRAM prices rising and mobile ASPs improving. Analyst Ryu Hyung-keun expects supply constraints and sustained growth through 2027, citing HBM4 contributions and disciplined CapEx.
TSMC achieved 98% yield on CoWoS-L packaging, enabling 5.5x reticle size chips in mass production. This milestone confirms TSMC's capability to handle larger dies, though thermal warping remains a challenge. Neutral impact on immediate pricing.
Cissoid has discontinued products based on its second-generation HADES gate driver chipset, including IPMs and ICMs, due to the discontinuation of X-FAB's Xi10 process. The company is accelerating the release of a third-generation redesign on a new fab, expected as early as next year. Bearish: The EOL of the 2nd gen products will trigger immediate supply shortages and price increases.
Navitas has sued Renesas, accusing the latter of stealing four patents related to GaN technology for AI data centers. This legal dispute highlights intense competition in the GaN sector. Neutral: No immediate impact on spot prices.
Lithography Semiconductor Equipment Co. (LSE) announced a strategic investment by TECO Image Systems Co. (TIS) to deepen cooperation in precision manufacturing and supply chain management. This partnership aims to build semiconductor equipment self-sufficiency and a China-free supply chain, with TIS Chairman Eugene Huang joining LSE's board.
South Korea's government established a 5 trillion KRW fund to support chip companies beyond Samsung and SK Hynix. This move aims to strengthen the nation's competitiveness amid the global AI infrastructure race. Bullish: The policy support signals increased investment and capacity expansion in the local semiconductor ecosystem.
Intel CEO Lip-Bu Tan confirms return to memory market, hiring SK Hynix veteran Seok-Hee Lee to develop XBM and ZAM architectures. This signals long-term R&D investment but lacks immediate supply chain impact.
Navitas Semiconductor filed a patent infringement lawsuit against Renesas Electronics in the U.S. District Court for the Eastern District of Texas, alleging infringement of four GaN patents. The lawsuit targets Renesas' SuperGaN product lines and aims to protect Navitas' IP portfolio in the high-power AI infrastructure market. Watch: This legal action may reshape the competitive landscape of GaN power semiconductors but is unlikely to impact spot prices in the short term.
Joby Aviation acquires Resonant Sciences for $500 million to expand its defense business. The deal is expected to close in the first half of 2027. Watch (M&A strategy).
ASE SPIL breaks ground on a 100 billion TWD plant to boost CoWoS capacity, with first-phase operations scheduled for 2028. This expansion targets the current AI chip packaging bottleneck. Bearish: Future supply increase will alleviate the current CoWoS shortage.
SK Hynix is expanding Solidigm's Dalian plant to 50,000 wafers/month of 100-layer NAND by H1 2027, focusing on mature floating-gate technology while reserving advanced 375-layer NAND for its Cheongju facility.
mature NAND supply, bearish for mature NAND prices.
Siliconware Precision Industries (SPIL) broke ground on a new plant in Douliu with a 100 billion NT$ investment to introduce CoWoS technology, targeting initial operations in 2028. This capacity expansion is driven by surging AI and HPC demand. Bearish: The announced capacity increase will likely alleviate future supply shortages, exerting downward pressure on prices.
TSMC and Sony formed a $4.69B joint venture to mass-produce next-gen CMOS image sensors in Japan, aiming to defend their market lead against Samsung and China. This vertical integration strategy focuses on technology leadership rather than immediate price impact. Traders should monitor long-term supply chain shifts.
Siemens and NVIDIA announced a collaboration at DAC to integrate NVIDIA's CUDA-X and NeMo models into Siemens' EDA tools for Agentic AI, aiming to improve semiconductor and PCB design flows. This partnership focuses on using AI agents for planning and execution, representing a significant R&D milestone in the EDA sector.
Sony and TSMC signed a definitive agreement to establish a joint venture in Japan to develop and volume-produce next-generation smartphone image sensors, with production slated to begin in 2029.
Agentrys launched Agentic Design Automation (ADA) at DAC 2026, an AI-native platform for automating complex chip design workflows.
Walsin Technology's inventory turnover ratio reached 1.8, with order visibility extending to the end of 2026. Driven by strong AI demand, the company plans to expand capacity for passive components. Bullish signal for supply chain tightness.
Navitas Semiconductor has filed a patent infringement lawsuit against Renesas Electronics. The case involves GaN and SiC power IC technology and was filed in the US District Court for the Eastern District of Texas.
Yageo and Walsin reported record July sales driven by AI demand, with high capacity utilization indicating supply constraints.
Liying Environmental Protection Technology reported record July revenue driven by rising demand for AI chip recycling. This reflects strong global appetite for AI semiconductors and increased utilization of advanced processes. Bullish for AI chip demand.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass chip map: 12 modules, 37 checkable identifiers (31 A / 6 B) and 19 public MPNs (16 externally searchable); A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.All teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |