RT NEWS: 👀 #TSMC’s #CoWoS crunch is reportedly sending some back-end packaging orders to #Intel Malaysia—a shift C.C. Wei has welcomed. ASE could...
TSMC is reportedly shifting some back-end packaging orders to Intel Malaysia due to CoWoS capacity constraints. C.C. Wei welcomed this diversification. Watch: This mitigates TSMC's immediate crunch but alters the competitive landscape for packaging capacity.
- Related manufacturers
- TSMC, Intel, ASE, Unimicron
- Impact score
- 70 / 100, high impact