King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early access to AI chip testing capacity in the US. The move further clarifies KYEC's plans to invest in the US, with Fort Worth, Texas, reportedly emerging as the likely site of its operations in the country. The event remains at the agreement/plan stage and the capacity is not yet built.
AI chip testing capacityKYEC, Nvidia and 3 totalDigiTimes AsiaCapacity Change
SEMI expects Americas 300mm fab equipment spending to more than double from US$18.1 billion in 2026 to US$40.6 billion in 2029, driven by U.S. investment and expansions by TSMC, Intel, Micron, and Samsung.
300mm fab equipmentTSMC, Intel and 5 totalTrendForceCapacity Change
Samsung Electronics has begun dispatching advanced-process yield engineers from South Korea to its Taylor, Texas foundry ahead of planned 2nm chip volume production in 2027. The South Korea's Financial News reported on October 12, citing industry sources.
Texas Instruments has introduced the ADC34DSO75, a 3-gigasamples-per-second (GSPS) analog-to-digital converter (ADC) designed to detect transient power events in AI data centers, enabling continuous, low-power, event-based remote monitoring at nanosecond resolution, and presented it alongside new high-voltage power management and clocking solutions at the 2026 Open Compute Project (OCP) Global Summit. TI also introduced the LMI800PS, an 800V isolated hot-swap controller that integrates functions previously implemented using five separate integrated circuits, combining an isolated bias supply and PMBus telemetry in a single package to reduce board area by more than 60%; it supports both ±400V and 800V distribution architectures with 5kVrms reinforced isolation and more than 8mm of creepage distance. TI also highlighted the LMK6B bulk acoustic wave (BAW)-based oscillator, which delivers 9.6fs jitter at 625MHz, supporting timing accuracy and signal integrity in high-speed networking systems as data transmission rates increase toward 3.2Tbps. In addition, TI will demonstrate 800V DC power solutions for NVIDIA's MGX AI Factory Ecosystem, including hot-swap protection and 800V-to-12V and 800V-to-6V DC/DC conversion, the latter incorporating gallium nitride (GaN) power stages, and has scheduled a technical presentation on 800V data center DC/DC design considerations, topology comparisons, and trade-offs for October 15, 2026, at the OCP Global Summit in San Jose, California.
On Oct. 12, 2026, Texas Instruments (TI) debuted new products at the Open Compute Project (OCP) Global Summit, including the ADC34DSO75, described as the industry's first ADC enabling 24/7, low-power, event-based remote monitoring at nanosecond resolution (a 3-gigasamples-per-second ADC, thousands of times faster than current solutions per TI), the LMI800PS, described as the industry's first 800V isolated hot-swap controller (replacing a discrete solution requiring five integrated circuits with a single package, reducing board area by more than 60%), and the LMK6B, a bulk acoustic wave-based oscillator delivering 9.6fs jitter at 625MHz. TI states these analog solutions address data center operators' challenges around power instability, inadequate real-time monitoring and signal degradation as AI workloads increase, and TI is also showcasing 800VDC power solutions in NVIDIA's MGX AI Factory Ecosystem. This is a product launch news item with no price or capacity change.
Major South Korean semiconductor materials, components and equipment suppliers will attend SEMICON West 2026, scheduled for Oct. 13-15 at the Moscone Center in San Francisco, US. According to the companies, growing investment in semiconductor manufacturing facilities in the US is drawing increased interest from South Korean firms in SEMICON West. Among materials suppliers, ENF Technology will showcase process materials including etchants, cleaning solutions, strippers and thinners; the company has supplied Samsung Electronics' Austin facility from its Kyle, Texas plant since 2021, completed capacity expansions for stripper and thinner production early this year, and began supplying Samsung Electronics' Taylor fab in the first half. Dongjin Semichem will present photoresists, thinners and CMP slurries; its thinners and high-purity sulfuric acid production facilities in Texas are targeting mass production by the end of this year and are expected to support Samsung Electronics' Taylor fab and other local operations. Equipment makers will showcase advanced packaging technologies for AI servers: Hanmi Semiconductor will exhibit TC bonders for HBM and 2.5D packaging, and Shindo Eng Lab will introduce its TGCV substrate technology combining glass and ceramic. Inspection and metrology firms will participate: Intekplus will present automated visual inspection and 3D metrology for packages and substrates and recently secured an order from a Japanese substrate maker for inspection equipment for glass-substrate R&D; Koh Young Technology will showcase 3D measurement-based inspection solutions. Test component suppliers ISC and LEENO Industrial will also attend. Gas delivery and control component suppliers BMT, DK-Lok and ASFlow, as well as equipment component and wafer-handling materials suppliers BOBU Hi-Tech and Glint Materials, will be represented. SEMI expects more than 1,500 booths and over 35,000 attendees at this year's exhibition.
semiconductor process materialsetchantscleaning solutionsENF Technology, Dongjin Semichem and 15 totalThe Elec
The Design Automation Conference (DAC) has opened its 2027 Call for Contributions under the theme reflecting that artificial intelligence is influencing both the systems engineers build and the methods they use to build them. The event is scheduled for July 11–14, 2027, at the San Jose Convention Center and will be DAC's first gathering in San Jose. Contributions will span AI, Design, electronic design automation, Security and Systems; participants can submit research papers, engineering presentations, panel proposals, special sessions, workshops and tutorials, alongside opportunities in the DAC Pavilion and Exhibitor Forum. The engineering tracks cover front-end design, back-end design, intellectual property, and systems and software. DAC 2027's leadership spans academia and industry: General Chair David Z. Pan represents The University of Texas at Austin and DeepWeave, Vice Chair Natarajan Viswanathan comes from Cadence Design Systems, Technical Program Chair is Ambar Sarkar of NVIDIA, with co-chairs Rajiv Joshi of IBM and Jiang Hu of Texas A&M University. This is a conference call-for-contributions announcement with no direct connection to chip supply, demand or pricing.
NVIDIA has released NVIDIA cuPhoton, an open-source CUDA-X toolkit intended to move high-throughput scientific image processing away from CPU-bound pipelines and onto GPUs. The software targets workloads including optical astronomy, X-ray analysis and laser experiments, where instruments can generate data far faster than conventional processing chains can analyse it. The source does not state any specific impact on supply, prices or demand.
Samsung is reportedly planning to exit the automotive application processor (AP) business it has pursued since 2018. According to the report citing industry sources, once Samsung completes production under existing supply commitments to Hyundai Motor (agreement secured in 2023) and Germany's BMW (secured last year), it plans to discontinue the development and mass production of successor Exynos Auto products; this is a reported plan, not a confirmed halt. Samsung will focus its System LSI operations on image sensors and next-generation mobile APs as it seeks to return the division to full-year profit next year. The stated causes are high development costs from stringent automotive safety and durability requirements and Qualcomm's effective dominance of the automotive AP market, which makes it difficult for Samsung to gain share. The System LSI and foundry businesses have together posted annual losses totaling trillions of won. In its latest detailed update released with second-quarter results in July, Samsung said expanded sales of mobile SoCs and image sensors helped System LSI post record first-half revenue in 2026. Samsung is developing the Exynos 2700 mobile AP, scheduled to enter mass production in the fourth quarter on Samsung Foundry's second-generation 2nm process, and seeks to expand its adoption in the Galaxy S27 series due in 2027; Samsung spent KRW 7.44 trillion on mobile APs from external suppliers in the first half of 2026. Samsung also plans to expand businesses including display driver ICs (DDIs), power management ICs (PMICs), and chip design for data centers.
automotive application processors (APs)image sensorsnext-generation mobile APsSamsung, Samsung Electronics System LSI division and 6 totalTrendForceEOL/Discontinuation
Related manufacturers
Samsung, Samsung Electronics System LSI division, Qualcomm, Hyundai Motor, BMW, Apple
Keysight Technologies, Inc. (NYSE: KEYS) announced the Velocity 4900 Series, a new line of cost-effective Layer 1 automation switches designed to automate physical connectivity in network test labs through software-controlled testbed configuration, supporting testing for networks and infrastructure for AI, 6G, and next-generation services. The first two models: the Velocity 4902 is a high-speed Layer 1 automation switch supporting Ethernet speeds from 100 Mbps to 100 Gbps, with 72 QSFP28 ports supporting 288 connections with breakouts; the Velocity 4906 is a high-density Layer 1 automation switch with 288 SFP28 ports supporting Ethernet speeds from 100 Mbps to 25 Gbps. Both switches provide true Layer 1 forwarding through an ultra-low-latency, fully transparent switching matrix, support single-mode fiber, multimode fiber, direct-attach copper, and active optical cables, and include port tapping for diagnostics and one-to-many traffic replication. According to the source, the product addresses test-lab bottlenecks such as reliance on manual cabling and physical topology changes that leave equipment underutilized and slow testing. The Velocity 4902 and 4906 are available for order immediately, with initial deliveries planned for January 2027.
Samsung Foundry may be on the verge of securing a deal to manufacture Anthropic's AI ASIC on its SF2 2 nm node, with an initial volume of around 200,000 chips, designed by Broadcom targeting approximately 4,000 TOPS of INT8 compute and a TDP of 1,300 W per chip, supported by either 192 GB or 288 GB of HBM3E, using I-Cube 2.5D packaging; the chips are currently produced in South Korea and a new facility is planned in Taylor, Texas.
Anthropic AI ASIC on 2 nm nodeSamsung Foundry, BroadcomTechPowerUpPartnership/M&A
Texas Instruments' Brian Burk discusses the future of battery monitoring systems, highlighting the shift towards safer and smarter energy storage solutions.
Samsung foundry recovery is accelerating with higher utilization and firmer pricing, though sustained profitability depends on 2nm yields and the Taylor fab ramp.
Texas Instruments' Mayrim Verdejo discusses strategies for managing complexity in modern analog and embedded system designs. The interview focuses on design methodologies rather than specific supply chain or pricing data. No immediate trading impact is expected.
Tesla and SpaceX face a trademark dispute over the 'Terafab' name with Tera-print, a nanotechnology firm. The dispute involves a cease-and-desist letter and settlement meetings, while the Terafab project aims to build an AI chip factory in Texas.
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Tesla, SpaceX and 3 totalTechPowerUpPartnership/M&A
Terafab faces a trademark dispute with Tera-Print, halting its chip production plans before the first unit is made. The conflict centers on the use of the name for high-volume manufacturing versus Tera-Print's tabletop lithography tools. Settlement talks are reportedly ongoing.
Marvell and GlobalFoundries are expanding SiGe wafer production to support 1.6Tbps optical transceivers for AI data centers. This partnership addresses supply constraints driven by the surge in AI demand and the physical limits of copper interconnects. Bullish for the optics sector as it secures capacity for next-gen CPO/NPO technologies.
On September 17, 2026, Texas Instruments (TI) (Nasdaq: TXN) announced it will raise its quarterly cash dividend 7%, from $1.42 per share to $1.52, or $6.08 annualized. The higher dividend will be payable November 10, 2026, to stockholders of record on October 30, 2026, contingent upon formal declaration by the board of directors at its regular meeting in October. The company said the increase is consistent with its long-term objective of providing a sustainable and growing dividend and reflects its continued commitment to return all free cash flow to its owners over time, and that the announcement marks 23 consecutive years of dividend increases. The release also includes forward-looking statement risk disclosures.
Berkeys Plumbing released a 2026 report on home comfort and energy savings, focusing on HVAC efficiency and maintenance. This background information on residential energy trends does not provide specific semiconductor supply chain data.