Kioxia launched the EG7, a QLC version of the BG7, offering 256GB-2TB capacities and PCIe Gen 4 speeds. The drive uses 218-layer QLC NAND and is currently sampling with general shipping expected this quarter.
Apple's M6 series launch delayed to 2027 due to DRAM and NAND flash shortages. Supply chain sources cite production challenges as the primary bottleneck despite TSMC N3P process advancements.
Kioxia suspended production at its Iwate NAND facilities following a magnitude 7.7 earthquake, while Tokyo Electron and material suppliers in the region face potential disruptions. Inspections are expected to last one to three days, raising concerns about a potential NAND shortage.
YMTC plans to add three new fabs, aiming to more than double its total wafer output from 200k to 400k wpm, with the first new fab starting production this year. This expansion, heavily reliant on domestic equipment post-U.S. Entity List restrictions, also includes a strategic push into DRAM production.
The significant capacity increase in NAND and potential entry into DRAM adds substantial future supply pressure, bearish for global memory pricing.
YMTC plans two additional Wuhan fabs, doubling monthly output to 200,000 wafers with Phase 3 using over 50% domestic equipment. This expansion tests domestic tool viability under U.S. sanctions. Bearish: Capacity growth signals potential oversupply, pressuring NAND and DRAM prices.
YMTC plans to build two new fabs alongside a third nearing completion, aiming to more than double its total NAND flash production capacity to over 500,000 wafers per month. This expansion occurs amid U.S. export restrictions and China's push for semiconductor self-sufficiency, with the company also entering the DRAM market. Bearish: Increased supply from a major market player, despite geopolitical constraints, adds downward pressure on global NAND and DRAM prices.
Nanya Technology reports Q1 ASP surged over 70% and forecasts DRAM prices to rise by double digits in Q2. The company secured a $2.5B private placement from key customers to fund capacity expansion and deepen collaboration on AI memory products. Bullish: Direct price forecast and capital injection signal sustained supply tightness and strong demand, particularly for AI-related DRAM.
SanDisk is reportedly accelerating its HBF pilot line timeline by half a year, targeting prototype production in 2H26 and commercialization in 2027. The technology leverages HBM ecosystem strengths, with SK hynix and Samsung also advancing their respective HBF standardization and patent efforts. Neutral: This is a long-term R&D milestone with no immediate impact on current component supply, pricing, or trading decisions.
SK Hynix has commenced shipments of its PQC21 consumer SSD, utilizing its latest 321-layer QLC NAND, to Dell for use in AI PCs. This launch underscores the ongoing industry trend towards higher-layer-count, higher-density NAND for capacity-focused applications. Neutral: This is a standard product launch with no immediate, quantifiable impact on supply, demand, or pricing for existing NAND components.
VDURA reported a 472% price increase for 30TB TLC enterprise SSDs between Q2 2025 and Q1 2026, with the April update raising the price to $17,500. This surge follows a 24% rise in the previous three weeks, driven by supply constraints from Kioxia and Phison. Traders should anticipate continued bullish pressure on enterprise storage pricing.
Samsung and SK Hynix are shifting to multi-year memory supply agreements, signaling a structural change in pricing and capacity planning for the AI era. Kioxia's move to resume dividends reflects confidence in the memory market's recovery. Watch: This shift towards long-term contracts could reduce spot market volatility but also tighten available supply for non-contract buyers.
Transcend reports DDR5 contract prices up 40-50% QoQ in Q2, aligning with TrendForce's 58-63% projection, driven by severe supply constraints from major vendors. DDR4 and MLC NAND supply is tightening due to phase-outs, though Transcend secured final industrial MLC buys.
Direct confirmation of significant Q2 price increases and persistent shortage across key memory segments.
Spot helium prices surged 40-100% following the removal of 27-30% of global supply due to Qatar's Ras Laffan facility outage. Samsung and SK hynix have signed higher-priced LTAs with Linde and Air Products to secure supply, while TSMC faces cost pressures as helium prices rose over 5% on April 2. Bullish: The supply shock and resulting price increases directly elevate production costs for major memory and logic chipmakers.
SK hynix commenced volume shipments of its industry-first 321-layer QLC cSSD (PQC21) to Dell Technologies in April. This move targets the high-capacity storage demand driven by AI PC and data center workloads. Neutral: The launch signals a technology roadmap shift but does not indicate an immediate supply constraint or price change for existing NAND products.
Samsung Electronics reported preliminary Q1 2026 operating profit of 57.2 trillion won, up 755% YoY, with its chip division contributing ~95%. The surge is driven by AI-led memory upcycle, with DRAM ASPs up ~90% QoQ and NAND in shortage. Bullish: Record earnings and confirmed Q2 DRAM price hikes of ~30% signal sustained strong demand and pricing power for memory components.
Nanya Technology reported record Q1 2026 revenue of NT$49.09 billion, surging 582.91% YoY, driven by a sharp rebound in the DRAM cycle. The March revenue of NT$18.17 billion also increased 16.42% MoM. Bullish: The financial results confirm strong DRAM pricing power and robust demand recovery.
Kioxia issued an EOL notice for its legacy 2D planar and sub-96-layer 3D NAND products, with sales ending September 2026 and shipments ceasing end of 2028. This move aligns with industry-wide shifts to higher-layer, cost-effective NAND production, as competitors have already phased out similar legacy nodes. Bullish: The removal of legacy NAND supply, coupled with capacity reallocation to newer nodes, tightens the supply base for older-generation chips.
Kioxia has issued an EOL notice for a wide range of legacy SLC and MLC NAND products, with phase-out completion targeted by 2026. This action reflects an industry-wide strategic shift towards advanced 3D NAND architectures and tighter capacity allocation. Bullish: The removal of legacy capacity constrains supply for specialized applications, likely supporting prices for remaining SLC/MLC inventory and creating substitution demand for newer 3D NAND.
The 'Father of HBM' predicts a shift from GPU-centric to memory-centric AI architectures, highlighting HBF as a post-HBM technology. SK hynix and Samsung are positioning for this future, with HBF engineering samples expected around 2027. Neutral: This is a long-term R&D roadmap with no immediate trading impact on current component supply or pricing.
Kioxia will discontinue 2D NAND and early-generation BiCS 3D NAND, with final shipments scheduled for December 2028. This marks the end of planar NAND technology, which began production in the 1980s. Bullish: The EOL plan will create scarcity for remaining legacy inventory, supporting prices.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |