EPC announced mass production of the EPC2370 GaN FET for AI power architectures, priced at $2.52 per unit. The device targets 6V high-current synchronous rectification in server power supplies. Bullish signal as supply ramps to meet growing AI computing demand.
Hexseed Technology raised £600,000 to scale low-temperature diamond coating technology for GaN devices in data centers. The funding aims to validate the process for commercial GaN chips to improve thermal efficiency and reduce energy loss. Neutral impact on current component prices; long-term technology trend for GaN cooling.
Signaloid CEO announced a new ASIC tape-out in May 2026, leveraging distribution-extended compute hardware (UxHw) to achieve 10-100x performance improvements in robotics and physical AI applications.
TSMC plans 2026 mass production of COUPE CPO solutions, achieving 200Gbps operation with double power efficiency. The vertical stacking of electronic and photonic dies via SoIC technology reduces latency, supporting AI networking demands.
The article highlights five upcoming next-generation M.2 SSDs designed for high-performance gaming PCs, workstations, and AI applications in 2026. These devices represent the next evolution in storage technology, likely targeting PCIe Gen5 standards. This is a future product announcement with no immediate impact on current supply or pricing.
Fujian Province announced a 15th Five-Year Plan targeting a RMB 300 billion output value for IC and optoelectronics clusters by 2030. The plan focuses on expanding capabilities in chip design, specialty processes, and optoelectronic components to support AI and high-end display markets. This policy signals long-term regional capacity expansion and government support for the semiconductor ecosystem.
Neuromorphic chips face security vulnerabilities like side-channel attacks due to their fused memory-compute architecture. Unlike traditional processors, these brain-inspired systems expose silicon and timing circuits to new cyber threats. Neutral impact on immediate trading decisions.
Unified memory architectures are emerging as a critical solution for edge AI systems to handle larger model contexts. This approach addresses the limitations of discrete memory in edge devices. The trend indicates a shift in memory architecture requirements but lacks specific supply or pricing data.
Researchers from TSMC and National Yang Ming Chiao Tung University engineered a 0.42-nanometer aluminum-oxide interface for monolayer MoS₂ transistors, enabling strong gate control. This breakthrough addresses interface defects in 2D semiconductors but has no immediate impact on current trading prices or supply chains.
ITC refused Qualcomm's request to stay the ban, forcing handset redesigns over 18-24 months. Broadcom claims Qualcomm refuses fair IP compensation. Bearish impact on supply chain due to regulatory risk.
NoMIS Power demonstrated a 6.5 kV SiC MOSFET with >8 kV blocking voltage and 90 mΩ Rds(on), currently in sampling. Mass production is scheduled for Q4 2026, extending their roadmap to 10 kV+ devices.
Sivers and SemiNex have announced a $3.4 million program to develop next-generation InP light sources for AI data center interconnects, focusing on high-power external cavity lasers and DFB arrays to address optical bottlenecks.
Yole forecasts the xEV power-device market to reach $14.5 billion by 2031, with SiC MOSFETs growing at a 21.5% CAGR. Driven by 800V architectures and Chinese BEV demand, SiC and GaN adoption is accelerating, though SiC manufacturers face overcapacity risks.
Cissoid has discontinued products based on its second-generation HADES gate driver chipset, including IPMs and ICMs, due to the discontinuation of X-FAB's Xi10 process. The company is accelerating the release of a third-generation redesign on a new fab, expected as early as next year. Bearish: The EOL of the 2nd gen products will trigger immediate supply shortages and price increases.
Navitas Semiconductor filed a patent infringement lawsuit against Renesas Electronics in the U.S. District Court for the Eastern District of Texas, alleging infringement of four GaN patents. The lawsuit targets Renesas' SuperGaN product lines and aims to protect Navitas' IP portfolio in the high-power AI infrastructure market. Watch: This legal action may reshape the competitive landscape of GaN power semiconductors but is unlikely to impact spot prices in the short term.
YMTC entered the global top three NAND makers with 14% share, but revenue lags due to low consumer prices. NAND contract prices surged approximately 75% in Q2 driven by AI server demand, while Samsung cut output to prioritize higher-margin DRAM.
Agentrys launched Agentic Design Automation (ADA) at DAC 2026, an AI-native platform for automating complex chip design workflows.
Longsys Chief Scientist Jian Chen highlighted a storage foundry model for Edge AI at FMS 2026. This discussion addresses the evolving storage requirements as AI workloads shift from cloud to edge devices. Neutral: While indicating potential demand for specialized storage, no specific supply or pricing data is provided.
Newark has partnered with Hailo to distribute edge AI processors globally via its network. Hailo's chips provide data center-class performance for applications like automotive and smart cities.
This partnership enhances market accessibility but does not immediately impact pricing or supply constraints.
CXMT achieved DDR5-8800 overclocking on AMD platforms, closing the gap with SK hynix. Despite being a relative newcomer to DDR5, CXMT is gaining traction with major brands like Colorful. Watch: Technical parity with SK hynix suggests rising competition in the high-end DRAM segment.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |