STMicroelectronics announced the RHFLVDS42, a QML-V qualified quad low-voltage differential signaling (LVDS) receiver for aerospace applications. The receiver enables data exchange at up to 600Mbps, operates over a wide voltage range from 2.3V to 3.6V, conforms to the latest TIA/EIA-644 and JEDEC low-voltage logic and power supply norms, and retains compatibility with legacy CMOS designs. Its input common-mode voltage range extends from -4V to +5V, and the absolute maximum voltage rating (AMR) is 4.8V. The device offers SEL-free (single event latch-up) operation at 122.6 MeV.cm²/mg, SET/SEU-free operation at 61.3 MeV.cm²/mg, stability per RHA QML-V at up to 300krad TID (Si), and 8kV ESD immunity. It is manufactured in Rennes, France, using ST's 130nm CMOS technology, and meets EAR99 export administration regulations, fitting supply-chain arrangements for organizations worldwide, including the USA and Asia. It operates from -55°C to +125°C, is supplied in a grounded-lid Flat-16 hermetic package, and can also be supplied as bare die.
At Synaptics Tech Day 2026 on October 20, 2026, Synaptics introduced what it calls a new class of microcontroller (xMCU), the Astra SR200 series, positioned between traditional MCUs and application processors. The family includes three pin-compatible members: the SR210 (200 GOPS, for voice and sensing), the SR230 (300 GOPS, for vision and display systems), and the SR250 (400 GOPS, for multimodal applications). The SR200 is built around an Arm Cortex-M85 processor running at up to 800MHz plus a lower-power Cortex-M52, with up to 8MB of SRAM and up to 256MB of high-bandwidth custom DRAM. Its Torq NPU subsystem combines Synaptics' own Torq T2 with Google Research's Coral NPU; the Coral NPU is based on the open RISC-V architecture, and Google Research is making the architecture available as open-source IP. Synaptics was the first commercial adopter and integrator of Google's Coral NPU IP, incorporating the first-generation architecture into its Astra SL family in 2025; the SR200 series incorporates the second-generation Coral NPU, which adds SIMD vector processing to improve performance and energy efficiency. Within the joint Coralboard development platform family, the Coralboard SL, based on the Astra SL2619 processor (dual Arm Cortex-A55 cores and a 1 TOPS NPU subsystem combining Torq T1 with first-generation Coral NPU), is now generally available through DigiKey following an initial limited release; the Coralboard SR, based on the new SR250, is being demonstrated in samples at Tech Day 2026, with broader availability anticipated in the first half of 2027. The Coralboard design incorporates a production-grade system-on-module (SoM) from Poland-based embedded hardware specialist GRINN. Google Research has further enhancements to the Coral NPU architecture in the pipeline, and Synaptics plans to continue introducing new processors and development boards as the technology evolves.
edge AI microcontroller (xMCU)neural processing unit (NPU) subsystemdevelopment boardSynaptics, Google Research and 3 totalEE Journal
The article explains that MEMS (micro-electromechanical systems) switches are gaining popularity in AI-driven optical networks, datacentres and other areas, and are considered a reliable replacement for semiconductor switches. Optical MEMS switches (optical circuit switches, OCS) route light signals directly via micromirror arrays, eliminating optical-electrical conversion and saving datacentre cost and power, and come in 2D and 3D types; RF MEMS switches come in ohmic (DC contact) and capacitive types and can replace PIN diodes and FETs. The article states MEMS switches are 90-95% smaller than semiconductor counterparts. Limitations noted: switching is microseconds slower than semiconductor switches, they require high actuation voltage, moving parts may wear, and they must be sealed against moisture; efficient MEMS switches remain in the research and development phase across enterprises and vendors, and commercialisation for AC/DC high-power handling systems is still awaited. The article contains no price, output or order data.
This is a technical review article (not a market event) describing simulation-driven thermal modeling for SiC and GaN power converters. It states that wide-bandgap (WBG) devices switch faster, offer higher breakdown voltages, and conduct with lower on-resistance per unit area, but heat is concentrated in a very small area, with local heat fluxes that can easily reach several kilowatts per square centimeter; unmanaged heat can cause thermal runaway, gate oxide degradation, solder joint cracking, and catastrophic device failure. A recent review in the MDPI journal Electronics highlighted that WBG performance is mainly constrained by the position of heat generation within the device and the effectiveness of heat dissipation from the package, rather than just the electrical characteristics of the semiconductor itself. The article notes 4H-SiC has thermal conductivity at room temperature about 3× that of silicon (about 490 W/m·K versus 150 W/m·K), but its thermal conductivity decreases significantly and nonlinearly under operation; lateral GaN HEMTs concentrate heat in a microscopic region near the gate edge, can develop local hot spots, and require high spatial resolution in the gate-drain region for thermal modeling. The described simulation toolchain has three levels: device/package-level 3D FEA/CFD simulation (e.g., Ansys Icepak, Siemens Simcenter Flotherm), reduced-order models (Cauer/Foster RC network ROMs, including Siemens' Embeddable BCI-ROM technology that allows sharing an accurate packaged-device thermal model while protecting OEMs' IP), and system-level electrothermal co-simulation. The article cites Onsemi, working with Ansys, developing a multifidelity thermal modeling process to validate SiC MOSFET power modules used in industrial applications, and describes machine-learning-based fast junction temperature estimation. The source contains no price, capacity, supply-demand, or market-change information.
South Korea's Defense Acquisition Program Administration (DAPA) will convene its Contract Review Committee on Oct. 20 to consider sanctions against LIG Defense & Aerospace (LIG D&A) for alleged bribery and fraud in projects worth 1.7 trillion won. Prosecutors found LIG D&A provided approximately 460 million won in bribes and benefits to key officials. This is the largest corruption scandal since DAPA's establishment in 2006.
LIG Defense & Aerospace (LIG D&A)The ElecPolicy/Regulation
According to industry sources on Oct. 20 (year not stated in the source), Samsung Electronics plans to manufacture its next-generation M2800 series mobile modem chips using a 2nm process, transitioning from the 4nm technology currently used for external modems; the external 5G modem M2800 is scheduled to complete development in 2027, is intended for the Galaxy S28 series due for release in 2028, and will be paired with the next-generation Exynos 2800 in a two-chip configuration. Moving modem production to 2nm will free up capacity on Samsung's 4nm lines, which the company plans to redirect toward HBM production; an industry official said "Samsung Foundry is converting much of its 4nm production capacity to HBM manufacturing," with the 4nm process used for the base die containing control circuitry at the bottom of an HBM stack. Samsung will continue using 4nm through the M2700, an external modem designed to accompany the Exynos 2700 in the 2027 Galaxy S27 series; the Shannon 5410 external modem used in the 2026 Galaxy S26 (also marketed externally as the Exynos Modem 5410) was also manufactured on a 4nm process, with Samsung equipping the South Korean versions of the Galaxy S26 and S26+ with the Exynos 2600 and Shannon 5410 combination while US models used Qualcomm's Snapdragon 8 Elite Gen 5. An industry official said Samsung has discontinued the Shannon modem brand and replaced it with the M-series. Although the M2700 uses the same 4nm process, it reportedly received favorable evaluations in internal testing by Samsung's Mobile eXperience (MX) Business, unlike its predecessor; Samsung improved power efficiency and data transmission speeds through design and software changes, reduced the chip's area by approximately 4% using optical shrink, and moved the modem from 3GPP Release 17 to Release 18 with improved NTN satellite communication capabilities. The official said the existing Shannon 5410 lagged behind competing products in idle power consumption and under standard power measurement conditions, and that the M2700, following voltage adjustments and other improvements, reportedly delivers performance comparable to or better than rival products. The 2nm transition and 4nm capacity conversion are plans; the source does not confirm their implementation.
mobile modemHBM base dieSamsung ElectronicsThe ElecCapacity Change
An industry article on evolving electronics procurement states that the electronica 2026 fair ranks among the world's leading electronics trade shows, and that the event will take place in Munich, Germany, from November 10 to 13, 2026. The article says supply chain management now matters as much as technology breakthroughs and that the event will gather firms and experts. No specific components, manufacturers, prices, or supply/demand figures are given, and the source does not state the cause.
Lee Nam-hoon, a director at Altera, said at the "Semiconductors That Power Humanoids" conference held alongside the Semiconductor Exhibition (SEDEX) 2026 at COEX in Seoul on Oct. 16 that Altera is targeting the physical AI market, including robotics and autonomous vehicles, with FPGAs designed for Nvidia's Holoscan Sensor Bridge (HSB). Altera developed the Holoscan Sensor Bridge with Nvidia to connect numerous sensors, including cameras, lidar, radar and ultrasonic sensors, to GPU platforms. The architecture connects sensors, FPGAs, Ethernet and GPUs in sequence: the FPGA aggregates data from sensors using different communication protocols and handles latency-sensitive operations in real time, including positioning, motor control and image preprocessing; the aggregated data is converted into Ethernet packets and transmitted directly to Nvidia GPU memory, bypassing the CPU to reduce latency, while a single high-speed Ethernet connection simplifies wiring and the approach reduces the limitations of the short transmission distances supported by MIPI. Altera offers four FPGA families for the HSB: the entry-level Cyclone, Agilex 3 for compact robots, Agilex 5 for next-generation robots including humanoids, and the higher-end Agilex 7; developers can select chips according to robot size, sensor count and data bandwidth. The company also supplies two modular development kits for Agilex 5-based reference designs and is working with partners including Terasic and Critical Link to develop an ecosystem of dedicated sensor boards, including system-on-modules (SOMs).
FPGAHoloscan Sensor Bridge (HSB)SOM (system-on-module)Altera, Nvidia and 4 totalThe Elec
According to industry sources on Oct. 20, Boeing recently asked Hanwha Systems to transition fighter jet displays from liquid crystal displays (LCDs) to organic light-emitting diode (OLED) panels, and Hanwha Systems is reviewing development options. Hanwha Systems currently supplies large area displays (LADs) for Boeing's F-15 fighter jet series and believes OLED products could be developed within two to three years if the necessary development conditions are established. Other defense contractors including Lockheed Martin have also expressed interest in adopting OLED technology; potential applications include F-15 fighters, F/A-18 fighters and Apache attack helicopters undergoing service-life extensions, with potential replacement demand estimated at 3,000 to 5,000 aircraft. The South Korean government and Hanwha Systems want LG Display—which previously developed military LCD panels for the KF-21 and F-15 and discontinued related LCD production in 2021—to participate, but the limited market size remains an obstacle: Hanwha Systems estimates it could realistically secure orders for only several thousand units, while a complete fighter cockpit display system costs approximately $1 million and an individual LCD panel costs as much as a midsize car. Lee Min-woo, director general for industrial growth at the Ministry of Trade, Industry and Resources, said at a Display Day event on Sept. 17 that the ministry was planning an R&D project with LG Display and Hanwha Systems for fighter cockpit OLED displays; if the project proceeds, LG Display would develop the panels and Hanwha Systems would integrate them into avionics equipment. Hanwha Systems currently sources panels from Taiwanese and Japanese suppliers.
fighter jet OLED displaysliquid crystal displays (LCDs)large area displays (LADs)Hanwha Systems, Boeing and 4 totalThe Elec
Related manufacturers
Hanwha Systems, Boeing, LG Display, Lockheed Martin
According to an analysis by Chinese semiconductor news outlet ijiwei, based on data from Japanese market research firm Techno Systems Research (TSR), OmniVision captured 13% of the global CMOS image sensor (CIS) market by revenue in 2025, surpassing Samsung Electronics' 12.8% share for the first time to become the world's second-largest CIS supplier; Sony retained the top position with a 54% share. OmniVision's CIS revenue totaled approximately $3 billion in 2025; per market research firm Yole, the global CIS market reached $25.3 billion in 2025, up 9% from 2024. ijiwei attributed the ranking change to a pullback by South Korean memory chipmakers: Samsung Electronics has shifted its focus toward high-bandwidth memory (HBM), while SK hynix has effectively exited the CIS market — SK hynix withdrew in March 2025, reassigning CIS personnel to AI memory operations including HBM. Onsemi's market share was below 3%. Samsung Electronics is reportedly seeking a rebound by securing Apple as a new customer, and is reportedly preparing to produce three-layer stacked CIS chips using hybrid bonding technology for a new iPhone series at its Austin, Texas, plant starting in 2026; Apple has previously sourced all CIS chips for its iPhones from Sony.
CMOS image sensors (CIS)OmniVision, Samsung Electronics and 5 totalThe Elec
Related manufacturers
OmniVision, Samsung Electronics, Sony, SK hynix, Onsemi
According to information gathered by THE ELEC on Oct. 20, Elon Musk's Tesla and SpaceX are holding talks with South Korean semiconductor materials, components and equipment suppliers to secure a supply chain for their Terafab chip manufacturing project. Several companies have already signed NDAs and advanced to discussions over specific products. On the morning of Oct. 13, the opening day of SEMICON West 2026 (held in San Francisco from Oct. 13 to 15), Terafab representatives visited booths operated by about 10 Korean companies, including ENF Technology, Dongjin Semichem, Asflow, BMT, GnG Intech, Unisem, MiCo and Hanmi Semiconductor; talks with many of these companies had already been underway for several months. ENF Technology, Asflow and GnG Intech made their first contacts during the event; BMT is in talks over valves and fluid-handling components; KoMiCo signed a three-party NDA with Tesla and SpaceX about a month ago to discuss cleaning services for an R&D pilot line in Texas; Unisem has signed an NDA to discuss environmental equipment including scrubbers; Dongjin Semichem has been in talks with Tesla for two to three months centered on its thinner production plant in Texas, with materials including phosphoric acid also under discussion; Hanmi Semiconductor is discussing the supply of thermocompression (TC) bonders; HPSP has agreed to supply one high-pressure hydrogen annealing (HPA) system for Terafab's R&D line; and ISC has advanced to exchanging samples and R&D design information. Overseas, Fujifilm holds regular meetings with Terafab's procurement team on potential supplies of CMP slurries, photoresists, etchants and cleaning chemicals, and Lam Research and Applied Materials are understood to have established dedicated Terafab teams. Tesla and SpaceX do not do business with Chinese suppliers, and industry officials said the companies are seeking prices even lower than those offered by Chinese suppliers, making Korea a good option. Terafab was jointly announced by Tesla, SpaceX and xAI in March, targeting a fab capable of processing 1 million wafers a month within 10 years, with an estimated initial investment of $16.8 billion and more than 3,000 jobs expected; SpaceX signed a tax abatement agreement with Texas earlier this month and began construction, and industry observers expect the initial 100,000-wafers-per-month facility to be completed before 2030. Most of these supply arrangements remain in the discussion stage and are not yet confirmed as final supply agreements.
semiconductor materialspiping componentsvalvesTesla, SpaceX and 16 totalThe ElecPartnership/M&A
AUO Chairman and CEO Paul Peng stated that the company is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing with Innolux on panel dimensions. AUO aims to leverage its glass-processing expertise to supply critical components and technologies to outsourced semiconductor assembly and test (OSAT) leaders such as ASE Technology Holding and Powertech Technology. This reflects the company's stated plan; the source provides no specific capacity figures, investment amounts, or timelines.
SEMICON West 2026 wrapped up in San Francisco (the source states only 'last week', with no specific date given). At the event, US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighted Taiwan as a critical partner in rebuilding US semiconductor manufacturing. Taiwan's role spans investment, process technology, supply-chain expertise, and talent development. No specific prices, capacity figures, or transactions are mentioned.
Yea Shin Technology, a subsidiary of Eris Technology, will begin trading on Taiwan's emerging stock market on October 23 and plans to raise the share of 6-inch wafers in its capacity from 35% to more than 50%, as its TVS products enter the international AI server supply chain. The source attributes this to AI servers driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. The increase in the 6-inch wafer share is a plan, not a completed outcome.
Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and AI computing chips. However, slower quarterly growth, mounting R&D expenditure and a steep share-price correction (a 51% slump) have highlighted the gap between the company's operating performance and market expectations. The source does not state the cause of the share-price decline.
domestic high-performance processorsAI computing chipsHygon Information TechnologyDigiTimes Asia
Powertip Technology is transitioning from a module design and supply company into a solutions provider. The company stated that it has seen rising demand in the first half of 2026 while the electronics and manufacturing industries faced higher material costs, which it aims to control by negotiating price adjustments with its customers. It noted that such negotiations are difficult due to intense market competition, and that failure to deal with the situation properly could impact future operations; the company also said similar circumstances previously occurred during the pandemic.
Genesem has reached an exclusive agreement with Company A, a top-three global semiconductor manufacturer, and its outsourced packaging partners to supply saw singulation equipment equipped with AI inspection capabilities starting in 2027. The GVISION AI+ passed mass-production qualification testing in the third quarter, with deliveries expected to total approximately 20 machines in 2027 and a contract value exceeding 30 billion won. AI capabilities have increased equipment prices by more than 10% compared to existing models.
saw singulation equipmentGVISION AI+Genesem, Company A and 3 totalThe ElecCapacity Change
Related manufacturers
Genesem, Company A, Company A's outsourced packaging partners
Gaonchips said on Oct. 19 that it will participate in the development of an artificial intelligence (AI) semiconductor for next-generation unmanned systems operated by Korea Aerospace Industries (KAI). Gaonchips will serve as a joint research and development partner in an aerial unmanned platform project overseen by KAI under the K-On-Device AI Semiconductor Technology Development Project, supported by the Ministry of Trade, Industry and Resources (MOTIR), with Supergate as the lead developer. The project aims to develop an AI system-on-chip (SoC) to serve as the brain of next-generation expendable unmanned aerial vehicles, enabling drones to run AI and carry out missions independently through on-device processing even where communications are disrupted or limited. Gaonchips will implement a domestically developed neural processing unit (NPU) and radar signal processing technology using Samsung Electronics' 8nm foundry process, and will handle physical design and final design verification of the entire chip; KAI will be responsible for system integration and verification of the unmanned platform, and Supergate will lead AI chip architecture design and software development. Gaonchips has experience developing and mass-producing 5nm on-device AI semiconductors and has worked on a 2nm GAA process and 2.5D packaging AI accelerator design project for a Japanese customer. The announcement describes a development project; no production or commercialization results are reported.
AI SoC (AI system-on-chip)neural processing unit (NPU)Gaonchips, Korea Aerospace Industries (KAI) and 4 totalThe ElecPartnership/M&A
Related manufacturers
Gaonchips, Korea Aerospace Industries (KAI), Supergate, Samsung Electronics
SK Materials JNC said on Oct. 20 that it signed a memorandum of understanding (MOU) with SN Display to establish a mass-production system for perovskite nanocrystal materials, aiming to advance the next-generation display material from the research and development stage to a level suitable for use in commercial displays. Under the division of roles, SN Display will provide its proprietary synthesis technology for perovskite light-emitting materials, while SK Materials JNC will handle material synthesis, mass production and quality control. SK Materials JNC already performs synthesis, production, device evaluation and quality control for organic light-emitting diode (OLED) materials, including boron-based blue dopants. SN Display is a display materials startup founded by Lee Tae-woo, a professor at Seoul National University; it possesses technology for large-scale synthesis of perovskite nanocrystals, has published related research in Nature and Science, and received a CES 2026 Innovation Award. SK Materials JNC CEO Ha Jung-hwan said that combining SN Display's proprietary perovskite technology with the company's synthesis and mass-production capabilities will accelerate the commercialization of next-generation display materials.
perovskite nanocrystal materialsperovskite light-emitting materialsboron-based blue dopantsSK Materials JNC, SN DisplayThe ElecPartnership/M&A
AdapTronics from Italy has won the Infineon Startup Challenge 2026 focused on key technologies for humanoid robots. AdapTronics won with an innovative gripping technology for humanoid robots. COSMOKE of South Korea was runner up with its magnetic tactile sensing technology COSKIN for physical AI, which enables humanoid robots to perceive touch, pressure, and physical interactions; TECHiFAB from Germany came third with an In-Memory Computing based approach to real-time motor control for robotic actuators. More than 100 startups from 29 countries participated, with 15 selected to pitch at the Infineon Startup Challenge Demo Day held during EBSCON in Graz, Austria. As the winner, AdapTronics will join the Infineon Startup Co-Innovation Program to further develop and scale its solution together with Infineon, with the collaboration officially kicking off at the Startup Night in Munich in November.