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NuAxi Stream - Real-Time Semiconductor Intelligence

NuAxi Stream - Real-Time Semiconductor Intelligence

Tue, Jun 30

1 items

20:10Impact score 5
AI封装瓶颈向硅片级转移
AI封装瓶颈正从基板向硅片级集成转移。CoWoS架构虽成熟但暴露了现代封装堆栈的极限。此为技术趋势分析，暂无直接价格影响。
Advanced Packaging Interposer Package SubstrateTechnical

Tue, Jun 16

1 items

21:00Impact score 10
玻璃基板引入垂直EM走廊，异构封装升级
文章提出AI封装将引入垂直系统电磁走廊，利用玻璃基板与TGV实现垂直信号与电源传输。随着带宽与功率密度提升，异构集成架构正从平面转向立体。
利多
长期利好玻璃基板与先进封装产业链的技术升级预期。
Glass Substrates TGVs Heterogeneous IntegrationTechnical

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Chip Teardown Lab1 opened

Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.

Component price indexNPI, vs. prior period

	$0.68	−5.9%
	$0.75	+0.2%
	$386.74	−21.3%
	$88.40	−0.2%
2026-W13	$14.89	−11.2%
	$478.20	+8.2%
	$0.68	−61.7%Unusual
	$0.01	+54.0%Unusual
	$0.12	−82.8%Unusual
2026-W13	$0.44	−12.5%
	$288.43	n/a

Period 2026-W18