According to The Wall Street Journal, Apple, once one of the most powerful buyers in the NAND flash market, is losing some of its negotiating leverage as AI-driven demand gives memory suppliers greater pricing power. Meta, Microsoft, and Amazon have signed long-term supply agreements with Kioxia this year at higher prices, strengthening the chipmaker's negotiating position. Separately, South Korean outlet Economy Tribune reports that Apple has reportedly turned to a long-term NAND supply agreement, with market watchers identifying Kioxia as the likely partner; the terms remain undisclosed and this is a reported plan. The report adds that Apple may also pursue long-term agreements with Samsung Electronics, SK hynix, and Micron to secure future LPDDR5X and LPDDR6 supplies. According to TrendForce, memory's share of the 256GB iPhone Pro's bill of materials rose from around 10% a year earlier to 34% in 3Q26 and could exceed 40% in 1H27; TrendForce also estimates the iPhone 18 Pro's total BOM cost could rise 38% YoY, potentially forcing Apple to sacrifice margins to maintain shipments.
NAND flashLPDDR5XLPDDR6Apple, Kioxia and 5 totalTrendForcePrice Movement
Related manufacturers
Apple, Kioxia, Samsung Electronics, SK hynix, Micron
China's semiconductor and electronics supply chains are reporting a wave of price increases: Goke Microelectronics has raised quotes for hybrid-packaged memory products, while Hygon is considering higher CPU and deep computing unit (DCU) prices. According to the source, the moves reflect rising costs for raw materials, components, and upstream supplies; however, the source states that whether they can help China escape deflationary pressure remains uncertain. Note: Goke's quote increase is an observed action, whereas Hygon's price increase is only under consideration and not confirmed as implemented.
hybrid-packaged memory productsCPUdeep computing unit (DCU)Goke Microelectronics, HygonDigiTimes AsiaPrice Movement
Hardware leaker KeplerL2 claimed on NeoGAF that the RAM and NAND flash storage in Sony's next console, the PlayStation 6, alone cost over $680, a figure that excludes the APU, cooling, power supply and the rest of the hardware. He posted it as a reply to a forum member who floated $680 as a possible subsidized retail price. This is not Kepler's first update: in March he put the console's bill of materials at around $760, and by July that estimate had climbed to roughly $960. Current leaks suggest the PS6 uses GDDR7 memory on a 160-bit bus supporting up to 40 GB, with 30 GB considered the more likely configuration; there have also been reports that Sony looked into cutting memory capacity to keep costs down. The source states the cause: AI data centers are soaking up DRAM and NAND supply, which pushes prices up for everyone. Sony has said nothing official about PS6 pricing, and the source advises treating the claims with caution; it adds that if memory prices stay where they are, a PS6 costing significantly more than the PS5 Pro seems likely, and a $1,000 price tag now looks quite possible.
GDDR7 memoryNAND flash storageDRAMSonyTechPowerUpPrice Movement
According to The Elec, ASML reportedly plans to raise prices by 10% on all replacement parts supplied to South Korea, covering both EUV and DUV lithography systems. The report notes that ASML notified Samsung Electronics and SK hynix of the planned increase through its South Korean subsidiary in early September, and the new prices will apply to deliveries starting in January 2027. The increase covers everything from regularly purchased consumables to major components replaced due to failures or declining performance; while ASML has previously adjusted prices for individual parts due to rising raw material costs or supply shortages, an across-the-board 10% hike is unusual, and industry sources suggest the company is seeking a larger share of its customers' profits. ASML is also reportedly discussing higher prices for newly ordered lithography equipment with major customers. For context, ASML generated €8.193 billion in revenue from services, replacement parts, and upgrades for installed equipment last year, roughly 25% of its total revenue of €32.667 billion, and expects this business to grow by more than 30% this year. According to Reuters, its EUV machines priced around US$200 million each are nearly sold out through 2027, and next-generation High-NA EUV systems are priced at roughly US$400 million each. ASML has also reportedly sought a 10% price increase for DUV lithography equipment, with some Chinese customers accepting, while TSMC is said to be resisting price hikes for both EUV and DUV systems; Applied Materials said in August that higher prices were supporting margin expansion, Tokyo Electron said in late July it was negotiating price adjustments to offset rising costs; lead times for certain deposition equipment components have increased from four months to as long as 10 months, and some Japanese-made laser-processing components face delivery times of up to 40 months. The source does not state a single definitive cause, linking the increases to AI-driven capacity expansion, inflation, and rising raw material costs.
EUV光刻系统更换零部件DUV光刻系统更换零部件EUV光刻设备ASML, Samsung Electronics and 6 totalTrendForcePrice Movement
Related manufacturers
ASML, Samsung Electronics, SK hynix, Applied Materials, Tokyo Electron, TSMC
ASML will raise prices by 10% across replacement parts supplied to South Korea, covering all parts for extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography systems, with the new prices taking effect for deliveries starting in January 2027. According to industry sources, ASML headquarters notified Samsung Electronics and SK Hynix of the proposed increase through its South Korean subsidiary in early September, and the increase was finalized after discussions with the purchasing organizations of both companies. Prices will rise for everything from consumable parts purchased regularly to major components replaced because of failures or performance degradation, raising the cost of keeping the equipment operational. Industry sources say ASML has traditionally adjusted prices for individual parts only when raw material costs rose sharply or specific materials became difficult to procure, making a blanket 10% increase unusual; an industry official said component prices have risen across the board but ASML also appears to be seeking a larger share of the profits its customers are making. ASML separately reports revenue from services, parts and upgrades for installed equipment, which totaled €8.193 billion last year, accounting for 25% of total sales of €32.667 billion, and the company forecast this revenue would grow by more than 30% this year. Prices for newly ordered equipment are also likely to increase, and ASML is discussing equipment price increases with major customers. The Information reported in July that ASML had notified Chinese semiconductor manufacturers and other customers of a 10% increase in DUV equipment prices, with some customers accepting, while largest customer TSMC was reportedly opposing the increase. Industry observers expect the across-the-board increase, accepted by Samsung Electronics and SK Hynix, to strengthen the position of other equipment and component suppliers seeking price increases: Applied Materials said in August that prices had risen for both new and existing products, Tokyo Electron said in late July it was pursuing price adjustments including for equipment already on the market, and Advanced Energy Industries said it had raised prices for some product lines. The source states the cause: AI data center investment has prompted memory makers and foundries to expand capacity simultaneously, driving up equipment and component orders while suppliers need time to expand production, creating a supply-demand imbalance; rising inflation and raw material costs have added to supplier cost burdens, giving suppliers greater negotiating leverage.
EUV lithography system replacement partsDUV lithography system replacement partsASML, Samsung Electronics and 3 totalThe ElecPrice Movement
MLCC, resistors, and inductors see prices rising 15% to 70% due to raw material inflation and supply constraints. AI and EV demand has pushed capacity utilization above 95%, creating a structural shortage. Bullish: Price uptrend confirmed.
MLCCTantalum capacitorsPolymer capacitorsElectronics SourcingPrice Movement
TrendForce estimates iPhone 18 Pro BOM costs will rise 38% YoY driven by memory price hikes, with memory now exceeding 40% of the total bill of materials. This significant cost increase suggests Apple will face margin pressure or pass costs to consumers.
DRAMNAND FlashApple, TrendForceTrendForce Official (Market Data)Price Movement
Qualcomm notified customers of double-digit percentage price increases for shipments starting September 1, adding to rising costs in the Android supply chain.
Qualcomm ChipsSnapdragon ChipsQualcommDigiTimes AsiaPrice Movement
TSMC plans to raise baseline prices on advanced nodes (7nm and below) by 5-10% and mature nodes by up to 10%, effective early 2027. Additional HPC capacity demand will incur a 10-15% premium, potentially totaling a 25% increase. Bullish for foundry pricing power driven by AI demand and rising tool costs.
Advanced Process NodesMature Process NodesHPC ChipsTSMC, Vanguard International Semiconductor and 3 totalTom's HardwarePrice Movement
ASML is reportedly planning price increases for existing Low-NA EUV tools, a move that could cost TSMC billions in additional capital expenditures. Despite TSMC's frustration, ASML CFO Roger Dassen confirmed that productivity gains justify these hikes, though implementation will take time due to long order lead times.
EUV Lithography MachineLow-NA EUV ScannerASML, TSMCTom's HardwarePrice Movement
Intel confirmed price hikes on select consumer and server CPUs due to rising costs and strong demand. Enthusiast processors rose $30-$50, while Xeon server chips increased by hundreds or thousands of dollars. This indicates strong market demand for specific SKUs.
CPUXeonCore Ultra 200S PlusIntelTom's HardwarePrice Movement
AMD notified AIB partners of a ~10% price increase for GPU core and GDDR memory bundle kits effective July 2026. This hike is driven by a global GDDR shortage and soaring spot prices that have tripled to $7.5/GB. The move signals a bullish outlook for GDDR pricing as supply constraints tighten.
Qualcomm launched the Snapdragon C platform for budget laptops, but TrendForce forecasts DRAM contract prices rose 90-95% in Q1 2026 and will climb a further 58-63% in Q2, threatening the sub-$500 laptop market.
DRAMMobile DRAMConventional DRAMQualcomm, TrendForceTom's HardwarePrice Movement
Wah Lee Industrial expands into standard gases and opens a Tainan logistics center in 2026. Chairman Gary Chang confirmed quarterly cost pass-throughs due to rising raw material prices. This supports a bullish outlook for semiconductor material pricing.
Standard GasesSemiconductor MaterialsPCB ProductsWah Lee IndustrialDigiTimes AsiaPrice Movement
Qualcomm's Snapdragon 8 Elite Gen 6 Pro SoC is reportedly priced above $300 due to TSMC's 2nm process costs. The total bill of materials with LPDDR6 and UFS 5.0 exceeds $600, pressuring smartphone margins. Bullish for Qualcomm pricing, bearish for OEM margins.
Snapdragon 8 Elite Gen 6 ProSoCQualcomm, TSMC and 3 totalTrendForcePrice Movement
Korea Customs Service data shows CCL import prices reached $20,728/ton in March, up 74.5% YoY. Kingboard and Japanese giants Resonac and Mitsubishi Gas Chemical have implemented multiple price hikes in 2026. Bullish. Tight supply driven by AI demand is pushing prices higher.
CCLFR-4 CCLPrepregs (PP)Kingboard, Resonac and 5 totalTrendForcePrice Movement
Related manufacturers
Kingboard, Resonac, Mitsubishi Gas Chemical Company, Elite Material Co. (EMC), Taiwan Union Technology Corporation (TUC)
Server CPU prices have risen 10-20% since March, with Intel and AMD signaling further hikes of 8-10% and 16-17% respectively in H2 2026. Lead times have extended from 1-2 weeks to 8-12 weeks due to AI-driven demand and advanced-node capacity constraints. Bullish: Direct and specific price increases with extended lead times indicate sustained supply pressure and upward pricing momentum.
Server CPUPC CPUIntel, AMDTrendForcePrice Movement
Shin-Etsu Chemical is raising silicone prices due to Middle East conflict-driven increases in crude oil and petrochemical costs, with distributor Topco Scientific expected to follow. The disruption to global energy supply chains is directly impacting upstream raw material costs for industrial materials. Bullish: Direct price increase announcement for a key industrial material signals immediate upward pressure on procurement costs.
SiliconeShin-Etsu Chemical, Topco ScientificDigiTimes AsiaPrice Movement
UMC plans wafer price adjustments in 2H26, with earlier reports suggesting a ~10% hike from July, driven by resilient demand and rising input costs. TSMC and Samsung are scaling down 8-inch capacity, tightening supply, with VIS already implementing a ~10% price increase in April. Bullish: Direct price pressure on mature-node foundry services, with confirmed hikes from multiple suppliers indicating sustained supply constraints.
Wafer Foundry ServicesUnited Microelectronics Corporation, Vanguard International Semiconductor and 3 totalTrendForcePrice Movement
Related manufacturers
United Microelectronics Corporation, Vanguard International Semiconductor, TSMC
IDC reports memory prices have doubled or quadrupled since last year, with DRAM and NAND forecast to rise 130% by 2026. Q1 shipments rose slightly as buyers pulled orders forward, but the trend is expected to reverse as costs peak. Geopolitical tensions and tariffs are driving up logistics and component costs, squeezing budget PC systems.