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Fraunhofer ISE and III/V-Reclaim develop 150mm InP-on-GaAs substrates that can replace prime InP wafers
What happened
Fraunhofer ISE and III/V-Reclaim have developed a process to create 150mm InP-on-GaAs substrates as a lower-cost replacement for prime InP wafers. This technology offers a scalable pathway to reduce material costs for high-performance InP-based semiconductor devices. 利空: This R&D milestone introduces a potential long-term, cost-effective alternative substrate, which could increase effective supply and put downward pressure on future prices for premium InP wafers.
Impact and signal
Low impactImpact score: 12/100
Affected components and suppliers
InP WafersIII-V Compound Semiconductors
cost-reductionsubstratemanufacturing
Source and time
Source: Semiconductor Today · 5/22/2025 · View original source
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