OKI and NTT establish mass-production technology for high-power terahertz devices by heterogeneous material bonding

What happened

Oki Electric and NTT Innovative Devices have established mass-production technology for high-power terahertz devices using a proprietary crystal film bonding (CFB) technique. The technology bonds InP-based UTC-PD photodiodes onto silicon carbide substrates to improve heat dissipation and bonding yields. Neutral: This is a long-term R&D milestone with no immediate impact on component supply, demand, or pricing for traders.

Impact and signal

Affected components and suppliers

Source and time

Source: Semiconductor Today · 6/23/2025 · View original source